ICSPCC2023 Paper Submission

General Information for authors

 

 

 

ICSPCC2023 Paper Submission Instructions

 

ICSPCC2023 starts reviewing your paper immediately after the submission.  This help to speed up the necessary revision of paper wordings and similarity/plagiarism check of the submitted paper.  The review result will be sent to author once the process is completed.

 

Papers submitted to ICSPCC 2023 must be original and previously has not been published. It is expected that the paper will describe original research, new ideas, promising approaches, useful applications, practices and expeiriences of the areas outlined in the scope of the conference. 

 

Paper accepted must be presented by one of the paper authors; either in oral or poster sessions. All presenting authors must register before the Registration Deadline to ensure their paper to be included in the Conference Proceedings and thus submitted for listing in IEEE Xplore.  There is current agreement between IEEE and Elsevier that the presented ICSPCC2023 Conference Papers could also be searchable in Engineering Index ( EI ).

 

Please note that you CANNOT change the title of the paper and the name of authors after submission for review.

 

Please format your paper using the following guidelines and according to the detailed explanations given in the sample manuscript, including setting of margins.

§          - All papers must be in English

§          - All papers must start with an abstract of 250 words or less.

§         - Double-check the paper size in your page setup to make sure you are using the A4 size paper

                layout (210 x 297mm)

§         - Papers should be about 4 pages, not exceeding 6 pages

§         - Do not number pages

§         - Figures and tables must be labeled with clear captions

 

Download Manuscript Templates:

     - Sample Template (Word DOC)

 

Plagiarism - authors are advised to check plagiarism of their papers before submission.   IEEE will use the plagiarism software Crosscheck to check your paper before the acceptance.  Your paper may not be accepted if the similarity is high.  Such papers may affect the acceptance of the paper submitted   

 

 


Click here to submit your paper
https://www.softconf.com/n/icspcc2023/

*If you have joined pervious ICSPCC, or, Softconf conferences, you can use the previous Softcon account to log in.

 

 

 
ICSPCC2023 Conference Organizing Committee
Steering Committee Chairs
Jianguo Huang, Northwestern Polytechnical Univ.
Jingdong Chen, Northwestern Polytechnical Univ.
General Chairs
Jie Chen, Northwestern Polytechnical Univ.
Lixin Zhang, Henan Univ.
Ray Cheung, City Univ. of HK
Susanto Rahardja, Northwestern Polytechnical Univ.
Shefeng Yan, Chinese Academy of Sciences
Technical Program Chairs
Chengbing He, Northwestern Polytechnical Univ.
Yang Lu, Henan Univ.
Peter Tam, IEEE HK Section
Gongping Huang, Wuhan Univ.
Special Session Chairs
Wentao Shi, Northwestern Polytechnical Univ.
Yong Jin, Henan Univ. 
Lingkun Ma,  Shaanxi University of Science & Technology 
Student Best Paper Award Chair
Jing Han, Northwestern Polytechnical Univ.
Xiaodong Cui, Northwestern Polytechnical Univ.
Publication Chairs
Edward Cheung, HK Polytechnic Univ.
Chao Pan, Northwestern Polytechnical Univ.
Publicity Chairs
Hongtai Yao, Henan Univ.
Xianghui Wang, Shaanxi University of Science & Technology 
He Xiang, Northwestern Polytechnical Univ.
Local Arrangement Chair
Qiyang Xiao, Henan Univ.
Registration Chair
Chengkai Tang, Northwestern Polytechnical Univ.
Finance Chairs
Lingling Zhang, Northwestern Polytechnical Univ.
Y.W.Liu, IEEE Hong Kong Section
Secretary 
Si Zhao, Northwestern Polytechnical Univ.
Sponsors
IEEE Xi’an Section
IEEE Hong Kong Section

Co-organizers

Henan University
Northwestern Polytechnical University
Technical Cosponsors
IEEE Hong Kong CASCOM Chapter
IEEE Xi’an SP Chapter

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