• Paper Submission


    General Information for authors


    ICSPCC2019 will start reviewing your paper immediately after the submission.  The review result will be sent to author once the process is completed.


    Papers submitted to ICSPCC 2019 must be original and previously has not been published. It is expected that the paper will describe original research, new ideas, promising approaches, useful applications, practices and experiences of the areas outlined in the scope of the conference. 


    Paper accepted must be presented by one of the paper authors; either in an oral presentation or poster session. All presenting authors must register before the Registration Deadline to ensure their paper to be included in the Conference Proceedings and thus submitted for listing in IEEE Xplore.  There is current agreement between IEEE and Elsevier that the presented ICSPCC2019 Conference Papers could also be searchable in Engineering Index ( EI ).


    Please note that you CANNOT change the title of the paper and the name of authors after submission for review.


    Please format your paper using the following guidelines and according to the detailed explanations given in the sample manuscript, including setting of margins.

    §          - All papers must be in English

    §          - All papers must start with an abstract of 250 words or less.

    §         - Double-check the paper size in your page setup to make sure you are using the A4 size paper

                    layout (210 x 297mm)

    §         - Papers should be about 4 pages, not exceeding 6 pages

    §         - Do not number pages

    §         - Figures and tables must be labeled with clear captions


    Download Manuscript Templates:

         - Sample Template (Word DOC)


    Plagiarism - authors are advised to check their papers before submission.   IEEE will use the plagiarism software Crosscheck to check your paper before the acceptance.  The result of similarity against other published papers should not be more than 30%.  Otherwise your paper may not be accepted in ICSPCC2019.  Authors are advised to check their papers before submission. 





    Spnsors and supporting organizations: -













    General Co-Chair
    Jianguo HUANG
    Northwestern Polytechnical University, Xian
    Yongchen Song
    Dalian University of Technology
    Oliver Choy
    Chinese Univ. of Hong Kong

    International Advisory Committee
    Nim CHEUNG (HK)
    Zhi DING (USA)
    Tariq DURRANI (UK)
    David FENG (Australia)
    Toshio FUKUDA (Japan)
    Mos KAVEH (USA)
    Alex C KOT (Singapore)
    Ray K. J. LIU (USA)
    K. M. LUK (Hong Kong)
    Zhi-Quan LUO (USA)
    Wan-Chi SIU (HK)
    Lawrence WONG (Singapore)


    Technical Program Co-Chair
    Jingdong CHEN, NPU, Xian

    Ray CHEUNG, CityU, HK

    Ricky LAU, CityU, HK.
    Jiandong LI, Xidian Univ, Xian
    Peter TAM
    , PolyU HK
    Hongyu WANG, DUT Dalian.
    Qun WU, HIT, Harbin.


    Track Co-Chair
    HO Wang-Hei, Ivan, PolyUniv,HK
    Bonnie LAW, PolytUniv HK
    Bo LI, NPU, Xian
    Yi Sun, Dalian Univ. of Tech
    Fuliang Yin
    , Dalian Univ. of Tech
    Chao WANG, Shanghai Univ
    Qunfei ZHANG, , NPU, Xian


    Special Scession Co-Chair
    Chengbing HE, NPU, Xian

    S H LEUNG, City Univ of HK  

    Qiuhua Lin, Dalian Univ. of Tech


    Local Arrangement Chair
    Hongxi Yin, Dalian Univ. of Tech


    Publication Chair
    Edward CHEUNG, PolyU, HK


    Publicity Co-Chair
    Xin LIU, Dalian Univ. of Tech
    Wentao SHI, NPU, Xian

    He XIANG, NPU, Xian


    Registration Co-Chair
    Xiaodong CUI, NPU, Xian
    Chengkai TANG, NPU, Xian


    Student Paper Award Co-Chair
    Jing Han, NPU, Xian
    Peter Tam, PolyU, HK


    Finance Co-chair
    Chengbing HE, NPU, Xian
    Y W LIU, HK CASCOM Chapter

    Lianyou JING, Dalian Univ. of Tech

    Lingling Zhang, NPU, Xian



    Dalian University of Technology

    Northwestern Polytechnical University, Xian

    Harbin Institue of Technology

    IEEE Xi’an Section

    IEEE Hong Kong Section

    IEEE Harbin Section


    Technical Sponsors

    IEEE HK CASCOM Joint Chapter

    IEEE Xi'an SP Chapter

    IEEE Harbin MTT/AP/EMC Joint Chapter

    IEEE Harbin GRSS Chapter

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